A Novel Approach on Reusing Silicon Wafer Kerf Particle as Potential Filler Material in Polymer Composite

In solar panel production stage, it is unavoidable to neglect the huge amount of grade silicon particles displaced during slicing ingot operation. A subject present study reuse solar-grade as a filler enhance mechanical properties epoxy-glass fiber polymer composite. Polymer composite was fabricated using hand-layup method with constant hydraulic pressure by varying weight percentages 0, 1, 3, 5, and 10 %. Particle size mineralogical features recovered particle were characterized analyser X-ray diffraction analysis. positive effect on prepared composites seen addition. Maximum tensile strength 284 MPa has been achieved for < µm 5 % loaded Both flexural hardness improved linearly addition material. The dielectric considerably incorporating into epoxy There comparatively higher value 5.96 in fine particle-filled than coarse 4.8. sustainable use wafer cutting would mitigate problems pollution minimise cost waste disposal well. This brings up solution recycling environment.